Printed Circuit Boards

High quality, on time & at competitive prices

The step from creating CAD/CAM software to also shipping printed curciut boards and stencils came very natural to us.
With great experience and wide knowledge we've become one of the leading suppliers on the Scandinavian markets.

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Leadtime	2L	4L	6L	8L	10-18L	>20L
Standard (Working Days to customer)	7	8	11	13	13-17	19
Fast (Working Days to customer)	3	3	3	3	6-8	10

PCB Specification:

Size	80 x 100 mm
Thickness	1.6 mm
Cu	35 um = 1 oz Finished
Surface	HASL Lead Free
Material	FR4 Tg130
Order as single Boards	5
Order Area	4 dm2

Prices:

Layers	Lead Time (Working Days to customer)	Price (SEK)
2	3	2650.00
2	7	1700.00

4	3	3900.00
	7	2500.00
	10	1850.00

6	3	5800.00
	7	4200.00
	10	3500.00

8	3	7600.00
	7	5650.00
	10	4770.00

Send your manufacturing data for easy quotation

Item		Technical Specification
Number of layers		1-50 Layers
Base material		ShengyiTG170, IT180, Teflon, Rogers, FPC
Finish board thickness		0.20mm-6.0mm
Minimum core thickness		0.10mm (4mil)
Copper thickness		Min 1/4OZ, Max 15OZ
Hole Copper thickness		Min 25um (1mil)
Panel size		600*1000mm(Max)
Min Hole Diameter	Drilling PTH	0.2mm (8 mil)
Min Hole Diameter	Blind hole	0.1-0.15mm (4 mil)
Aspect ratio		12:01
Solder mask	Color	Green, Black, White, Yellow, Blue, Red, Matte green, Matte black, Clear
Solder mask	Bridge	min 0.1mm (4 mil)
Dimension	Hole position	0.05mm (2mil)
Tolerance	Conductor width(W)	1mil Deviation of Master A/W
	Hole Diameter(H)	NPTH: +/-0.05mm(2min)
	Hole Diameter(H)	PTH: +/-0.05mm(2min)
	Outline Dimension	0.10mm (4 mil)
	Conductors & Outline	0.13mm (5 mil)
	Warp & Twist	0.50%

Item		Technical Specification
Surface Treatment		Leadfree HASL	3um (min)
		OSP	0.2-0.5um
		Immersion Silver	0.15-0.5um
		Immersion Tin	0.8-1.2um
		Immersion Gold	Au 1-10u"
		Hard Gold	Au 5-50u"
		Selective Gold	Au 3-150u"
		Ni/Pd/Au	Pd 4u" Au 4u"
V-cut	Board thickness	Min 0.30mm (12mil)
	Tolerance	+/-0.1mm (4mil)
	Groove width	0.38mm (15mil) max.
	Groove to groove	10mm (394mil) min.
	Groove to trace	0.38mm (15mil) min.
Slot	Slot size tol. 2W+ L	PTH slot; L: +/-0.10 (4mil)
		W: +/-0.05 (2mil)
		NTH slot (mm); L: +/-0.08(3mil) (4mil); W: +/-0.05 (2mil)
Hole edge to hole edge	0.30-1.60 (Hole Diameter)	0.10mm (4mil)
Hole edge to hole edge	1.61-6.50 (Hole Diameter)	0.13mm (5mil)
Minimum spacing between hole edge to circuitry pattern	PTH hole:0.20mm(8mil)	PTH hole:0.13mm(5mil)
Minimum spacing between hole edge to circuitry pattern		NPTH hole:0.10mm(4mil)

Item		Technical Specification
Multi layers	Layer-layer misregistration	4 Layers	0.10mm (4mil) max.
		6 Layers	0.13mm (5mil) max.
		8 Layers	0.15mm (6mil) max.
	Min. spaing from hole edge to innerlayer pattern	0.15mm (6mil)
	Min. spaing from outline to innerlayer pattern	0.225mm (9mil)
	Min. board thickness	4 Layers: 0.30mm (12mil)
		6 Layers: 0.50mm (20mil)
		8 Layers: 0.75mm (30mil)
	Board thickness tolerance	4 Layers: +/-0.10mm (4mil)
		6 Layers: +/-0.13mm (5mil)
		8-12 Layers: +/-0.15mm (6mil)
Insulation Resistance		10K Ohm - 20M Ohm (typical 5M Ohm)
Conductivity		<50 Ohm (typical 25 Ohm)
Test voltage		250V
Impedance control		Typical: 50 Ohm +/-10%

Copper plated PCB

Surface finishing: Immersion Gold

Product layer: 8L

Min hole size: 0.2

Board thickness: 1.6mm

Board size: 167*167mm

Materials: Shengyi

Special requirement: Via Plugging with copper
2 Layer pcb complies with IPC III

Surface finishing: Immersion Gold

Product layer: 2L

Board thickness: 1.0mm

Board size: 88*44mm

Materials: Shengyi

Special requirement: IPC Class III,Half hole,edge plated
18 Layer PCB

Surface finishing: Immersion Gold

Product layer: 18L

Min trace width/spacing: 4/4mil

Finished copper thickness: 1oz

Materials: Shengyi Tg170

Min hole size: 0.2mm

Board size: 172*140mm

Special requirement: High Layer
3 Layer Rigid Flex

Surface finishing: Immersion Tin

Product layer: 3L Rigid flex

Width/space: 4 mil / 4 mil

Min hole size: 0.3mm

Finish thickness: 0.05mm (flex). 1.6 mm

Special requirement: FR4 + Polyimide
4 Layer Rigid Flex

Surface finishing: Immersion Gold

Product layer: 4L Rigid flex

Width/space: 4 mil / 4 mil

Min hole size: 0.25mm

Finish thickness: 0.1mm (flex). 1.6 mm

Special requirement: FR4 + Polyimide
6 Layer Rigid Flex

Surface finishing: Immersion Gold

Product layer: 6L Rigid flex

Width/space: 4 mil / 4 mil

Min hole size: 0.4mm

Finish thickness: 0.1mm (flex). 1.6 mm

Special requirement: FR4 + Polyimide
1 Layer FPC

Surface finishing: Immersion gold

Product layer: 1L

Board thickness: 0.01mm

Finished copper thickness: 1oz

Board size: 247*145mm

Special requirement: FPC
1 Layer FPC

Surface finishing: Immersion gold

Product layer: 1L

Board thickness: 0.1mm

Finished copper thickness: 1oz

Board size: 78*78mm

Special requirement: FPC
2 Layer FPC

Surface finishing: Immersion gold

Product layer: 2L

Board thickness: 0.25mm

Finished copper thickness: 1oz

Board size: 30*20mm

Special requirement: FPC
6 Layer HDI

Surface finishing: Immersion Gold

Product layer: 10L

Min trace width/spacing: 4/4mil

Finished copper thickness: 1oz

Min hole size: 0.1mm

Board size: 191*133.5mm

Special requirement: HDI,blind via and buried via
6 Layer HDI

Surface finishing: Immersion Gold

Product layer: 6L

Min trace width/spacing: 4/6mil

Finished copper thickness: 1oz

Min hole size: 0.1mm

Board size: 86.50*102.50mm

Special requirement: HDI
10 Layer HDI

Surface finishing: Immersion Gold

Product layer: 10L

Min trace width/spacing: 3/3mil

Finished copper thickness: 1oz

Min hole size: 0.1mm

Board size: 200*150mm

Special requirement: HDI; L1-L2,L2-L3,L8-L9,L9-L10: blind via;L3-L8: buried via
1L Rogers PCB

Surface finishing: ENIG

Product layer: 1L

Finished copper thickness: 1oz

Board thickness: 0.8mm

Board size: 173*81mm

Special requirement: Rogers 4350B
2L Rogers PCB

Surface finishing: ENIG

Product layer: 2L

Finished copper thickness: 1oz

Board thickness: 1.0mm

Board size: 120*120mm

Special requirement: Rogers 4003C
Multi-Layer Rogers PCB

Surface finishing: ENIG

Product layer: 4L

Finished copper thickness: 1oz

Board thickness: 1.0mm

Board size: 62*62mm

Special requirement: Rogers 4350B
2 Layer power supply product

Surface finishing: HAL

Product layer: 2L

Finished copper thickness: 15oz

Board size: 546*203mm

Special requirement: Heavy Copper
Immersion gold power product

Surface finishing: Immersion Gold

Product layer: 2L

Finished copper thickness: 3oz

Board thickness: 3.0mm

Board size: 80*80mm

Materials: TG170

Special requirement: Au.5''
6 Layer power product

Surface finishing: HAL

Product layer: 6L

Finished copper thickness: 2oz

Board size: 200*150mm

Materials: IT180

Special requirement: IPC Class III
High Thermal conductivity Aluminium PCB

Surface finishing: OSP

Product layer: 1L Alu.

Finished copper thickness: 1oz

Board thickness: 1.0mm

Board size: 40*40mm

Materials: IT180

Special requirement: Thermal conductivity is 3.0 W/m-k
High Thermal conductivity Aluminium PCB

Surface finishing: LF HAL

Product layer: 1L

Finished copper thickness: 2oz

Board thickness: 1.5mm

Board size: 65*65mm

Special requirement: Thermal conductivity is 2.0 W/m-k
Aluminum board with counter-sink hole

Surface finishing: LF HAL

Product layer: 1L

Finished copper thickness: 1oz

Board thickness: 1.0mm

Board size: 158.75*124mm

Materials: Aluminium

Special requirement: 4 Countersink, Thermal conductivity is 2.0 W/m-k